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| Nama Merek: | KHJ |
| Nomor Model: | V |
Product Description
E1-IH810B is a polyimide (PI) high-temperature protective tape with an organosilicone-based pressure-sensitive adhesive. It features excellent adhesion performance, outstanding high-temperature resistance, and anti-static properties, making it ideal for demanding semiconductor packaging and electronics manufacturing processes.
Product Structure
Product Features
Product Applications
E1-IH810B is suitable for high-temperature masking protection in various semiconductor packaging processes, temporary fixation during high-temperature procedures, and as a carrier for supporting and protecting ultra-thin objects during transfer. It is especially designed for surface protection applications requiring removal after high-temperature processing without leaving any adhesive residue, and for environments where ESD (electrostatic discharge) protection is required.
Performance Parameters
| Property | Value / Specification | Test Method |
| Substrate Thickness (mm) | 0.025 ± 0.003 | Micrometer |
| Total Product Thickness (excl. release film) (mm) | 0.035 ± 0.005 | Micrometer |
| Release Film Thickness (mm) | 0.075 ± 0.003 | Micrometer |
| Core Inner Diameter (mm) | 77 ± 2 | Vernier Caliper |
| Peel Force (N/25mm) | 4 – 5 | GBT 2792-2014 |
| Tensile Break Strength (kN/m) | ≥ 3.5 | GBT 30776-2014 |
| Elongation at Break (%) | ≥ 45 | GBT 30776-2014 |
| Maximum Operating Temperature (°C) | 260 | — |
Precautions
